文献详情
Intercalating copper into layered TaS2 van der Waals gaps
文献类型期刊
作者Liu, Rui[1];Wang, Cong[2];Li, Yuanyuan[3];Xie, Yong[4];Chen, Qiang[5];Chen, Ziyu[6];Liu, Qian[7]
机构
通讯作者Chen, ZY (reprint author), Beihang Univ, Dept Phys, Minist Educ, Key Lab Micronano Measurement Manipulat & Phys, Beijing 100191, Peoples R China.; Liu, Q (reprint author), Natl Ctr Nanosci & Technol, 11 Beiyitiao, Beijing 100190, Peoples R China.; Liu, Q (reprint author), Nankai Univ, TEDA Inst Appl Phys, MOE Key Lab Weak Light Nonlinear Photon, Tianjin 300457, Peoples R China.
来源信息年:2017  卷:7  期:74  页码范围:46699-46703  
期刊信息RSC ADVANCES影响因子和分区  ISSN:2046-2069
增刊正刊
摘要Since graphene was successfully exfoliated, intercalation has been reviewed from bulk materials to twodimensional counterparts. Here 1T phase Cu-TaS2 was successfully prepared via intercalating Cu into 2D layered TaS2 based on a solution method, which cannot damage the crystal structure of the target material and can realize uniform intercalation with a large amount of dopants. The electrical conductivity of 2D TaS2 intercalated by Cu has an obvious increase compared with 2D TaS2. Considering the peculiar metal-insulator transitions (MITs) of TaS2, our work may provide new opportunities for future superconductor and CDW-based memory devices.
收录情况SCIE(WOS:000412451500021)  EI(20174104265283)  
所属部门物理科学与核能工程学院
DOI10.1039/c7ra08630j
百度学术Intercalating copper into layered TaS2 van der Waals gaps
语言外文
ISSN2046-2069
人气指数1196
浏览次数1195
基金National Natural Science Foundation of China [11474015, 61227902, 1177040279, 61405223, 51502011, 10974037]; National Key Research Program of China [2016YFA0200403]; CAS Strategy Pilot Program [XDA 09020300]
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