文献详情
Microstructure Evolution of Monolithic Nanoporous Copper from Dual-Phase Al 35 Atom % Cu Alloy
文献类型期刊
作者Liu, Wenbo[1];Zhang, Shichao[2];Li, Ning[3];Zheng, Jiwei[4];Xing, Yalan[5]
机构
通讯作者Liu, WB (reprint author), Sichuan Univ, Sch Mfg Sci & Engn, Chengdu 610065, Peoples R China.
来源信息年:2010  卷:157  期:12  页码范围:D666-D670  
期刊信息JOURNAL OF THE ELECTROCHEMICAL SOCIETY影响因子和分区  ISSN:0013-4651
增刊正刊
摘要Before uniform nanoporous structure can be achieved through chemical dealloying of dual-phase Al-Cu alloy with 35 atom % Cu in a hydrochloric acid (HCl) or sodium hydroxide (NaOH) aqueous solution under free corrosion conditions, microstructure evolution of the alloy during dealloying process in each solution is investigated and their formation mechanism is discussed. The microstructure of as-dealloyed samples was characterized using X-ray diffraction, scanning electron microscopy, energy dispersive X-ray analysis, transmission electron microscopy, and high-resolution transmission electron microscopy. The experimental results show that the alloy presents remarkably different microstructure evolution characteristics during dealloying process in the acidic/alkaline corrosive environment, which can be attributed to the difference between electrochemical activities of Al in two distinct phases of the alloy. Additionally, an evidently small pore size can be obtained in the as-dealloyed samples upon dealloying in the NaOH solution compared with relatively large one formed in the HCl solution, which mainly results from the lower surface diffusivity of Cu atoms along the alloy/solution interfaces in the alkaline solution. (C) 2010 The Electrochemical Society. [DOI: 10.1149/1.3497308] All rights reserved.
收录情况SCIE(WOS:000283938300061)  EI(20104713412831)  
所属部门材料科学与工程学院
DOI10.1149/1.3497308
学科电化学;材料科学:膜
百度学术Microstructure Evolution of Monolithic Nanoporous Copper from Dual-Phase Al 35 Atom % Cu Alloy
语言外文
被引频次22
人气指数27
浏览次数27
基金State Key Basic Research Program of PRC [2007CB936502]; National Natural Science Foundation of China [50574008, 50954005]; National 863 Program [2006AA03Z230, 2008AA03Z208]
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